Failure Analysis Engineer – Microscopy & Materials (m/f/d)

You will drive the exciting greenfield setup of our brand-new local FA laboratory – overseeing the move-in, installation, and qualification of cutting-edge analytical equipment. Once operational, you will run advanced electron microscopes to analyze defect samples, support production tool qualifications, and troubleshoot process issues.

This is a unique opportunity to blend high-level material science with practical, hands-on diagnostics to maximize the reliability of our products!

1. Lab Establishment: Lead the physical setup of the local Dresden FA Lab, including the installation, qualification, and initial calibration of advanced analytical instruments.

2. Physical Failure Analysis: Apply hands-on expertise using advanced microscopy and sputtering systems (including TEM, SEM, and FIB) to perform high-resolution sample characterization.

3. Root-Cause Investigation: Support fab engineers in diagnosing defect, yield, and reliability failures by providing timely, high-quality sample analyses.

4. Team Coordination: Train and functionally guide FA lab technicians in running routine sample preparation, standard monitoring, and continuous improvement tasks.

5. Process Improvement: Build and document specialized local knowledge regarding material structures, defect physics, and packaging failure mechanisms.

6. Production Continuity: Deliver on-duty laboratory coverage during holidays and occasional planned weekend overtime (approximately once per month) to support critical production issues.

Are you passionate about investigating the microscopic root causes of complex technical challenges? As a Failure Analysis Engineer (m/f/d) at ESMC, you will be the lead detective of our semiconductor fabrication facility in Dresden.

1. Education: Bachelor’s or Master’s degree in Material Science, Physics, Nanotechnology, Electrical/Chemical Engineering, or a related scientific discipline.

2. Hands-on Experience: Minimum of 1 year of practical experience operating advanced microscopy tools (such as SEM, TEM, or FIB). Note: Relevant master's thesis work, university research projects, or internships will be fully considered for ambitious fresh graduates.

3. Problem-Solving Mindset: A structured, detail-oriented approach to analysis with a passion for troubleshooting and technical forensics.

4. Languages: Fluency in English (written and spoken) is required.

5. Flexibility: Adaptability to evolving tasks in a dynamic startup/greenfield environment, and a readiness to support occasional weekend/holiday standby shifts.

1. Prior experience in semiconductor failure analysis, wafer manufacturing, or cleanroom environments.

2. Knowledge of basic chemistry/etching processes for physical sample preparation.

3. Basic communication skills in German and/or Mandarin.

1. Help build a completely new semiconductor manufacturing site in Europe.

2. Work in a highly international environment with colleagues across Europe, Taiwan and the US.

3. Shape processes instead of maintaining existing structures.

4. Participate in global projects and cross-functional collaboration.

5. International onboarding including 9 months of training in Taiwan.